Job Details

Performs a variety of technical tasks associated with backside wafer processing and assembly operations. This role supports production and engineering priorities in a cleanroom environment, focusing on die preparation, hybridization, wicking, and wire bonding processes. This is a second shift position from 2:30 pm to 11:00 pm M-F. Primary Duties & Responsibilities. Hybridization Support. Clean and inspect diced die using approved solvents and cleaning methods. As needed operate hybridization tools and maintain process parameters for yield optimization. Wicking & Underfill. Perform wicking operations to ensure proper underfill application. Monitor curing cycles and maintain accurate process logs. Wire bonding. Prepare substrates, load programs, perform wire bonding. Inspect bonds for quality and reliability using microscopes and metrology tools. General Responsibilities. Maintain detailed records of SPC charts, tool usage, and consumables. Follow ISO Class 6 cleanroom protocols and 6 S ...Processing Technician, Technician, Processing, Operations, Technical, Manufacturing, Healthcare